San Antonio, Texas - Genesi is pleased to announce that it has begun the development of a complete system solution using Redistributed Chip Packaging (RCP) Technology from Freescale.  RCP System Solutions are anticipated to lower system costs, improve performance and provide a platform that can be modified or upgraded once a system has been deployed. Firmware and software will become a function of the RCP itself. Genesi will be offering RCP System Solutions to all Efika MX Technology Licensed Partners.

Genesi is integrating a dual/quad-core i.mx6 processor, memory, Flash, a housekeeping / security processor, a PMIC and other smaller components. The RCP System Solution is based on the Efika MX6. RCP is an interconnect buildup technology in which the package becomes a functional part of the die. Freescale and RCP were recently featured in the MIT Technology Review: Wanted for the Internet of Things: Ant-Sized Computers.

About Freescale

Freescale is the global leader in embedded processing solutions, advancing the automotive, consumer, industrial and networking markets. From microprocessors and microcontrollers to sensors, analog ICs and connectivity – Freescale technologies are the foundation to innovations that make our world greener, safer, healthier and more connected.